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Produce 3D-MIDs in six steps The production line shown here is used to make a fully functioning digital thermometer as a 3D-MID. Learn more: https://www.lpkf.com/en/industries-te... Download our 3D-MID design rules for developers: hhttps://en.lpkf.com/knowledge-center/... The steps are based on LDS technology. The LDS production steps are layout production, injection molding, laser structuring, metallization, assembly and soldering. Structuring is handled by the LPKF Fusion3D 1100 laser system; metallization by the LPKF ProtoPlate. The 3D-MID production line was set up at "SMT Hybrid Packaging 2012" in Nuremburg. The speaker is LPKF Sales Manager Edgar Roddewig. Process Steps of LDS Technology: 00:00 1. Design & Engineering 00:36 2. Injection Moulding 01:15 3. Laser Direct Structuring 01:59 4. Metallization 02:36 5. 3-D Assembly 03:27 6. Vapour Phase Soldering Hello and welcome to the SMT-Show 2012 in Nuremberg. My name is Edgar Roddewig from company LPKF Laser & Electronics. I’m here to present all the process steps of the LDS process here on the booth of the 3-D MID association. With this demonstrator I will show you all the steps. First, you start with an idea. You have to combine your circuitry together with the plastics body.Now it’s time that your idea becomes reality. The LDS-grade granulate is transformed in the molding machine in a 1k one-shot process to your part. You normally fill your granulate here in the machine. But this is just a small machine where these parts can’t be produced. In the big machines, after 10 to 15 seconds, this part is produced. This is the third process step: the laser structuring. Here your wiring is written on the surface of your MID part. I will show you. Now you see the laser structuring on the surface and we can go to the next process step. This is the fourth step of the LDS process. Here you see the metallization of the laser activated parts. Typically copper, nickel and gold layers are applied. In this case you see a copper bath in a laboratory size. For sure, mass production is possible in big plating lines, too. This is the result after plating with copper, nickel and gold. So we are here at the fifth step of the LDS process chain: the three-dimensional pick & place system. After metallization of the LDS part, the parts are moved in the machine and three process steps are going on. First, the alignment of the parts, then applying solder paste on the pads, on the board, on the plastic parts and then putting the electrical devices on the solder paste. This is the sixth and final process step in the LDS process. Here the reflow soldering of the parts is done. This system is specially for vapour phase soldering. The parts are moved in and the solder paste is melted and the parts are strongly banded to the LDS part. Now our LDS part is ready and I will show you the functionality. Equipped with a battery it’s a digital thermometer. Produce 3D-MIDs in six steps