S4-E2_MEMS webinar series_Part2-MUMPs technology platforms from MEMSCAP скачать в хорошем качестве

S4-E2_MEMS webinar series_Part2-MUMPs technology platforms from MEMSCAP

In the second webinar, Dr. Sambuddha Khan from Tyndall National Institute will focus on Microfabrication technology platforms from MEMSCAP that are available in Multi-Project-Wafer (MPW) mode through EUROPRACTICE. The MEMSCAP foundry offers three Multi-User MEMS Processes (MUMPs), namely SOIMUMPs, PiezoMUMPs and PolyMUMPS. The PolyMUMPs platform is suitable for users who need a surface micromachining process by means ofthree thin-film polysilicon layers, whereas SOIMUMPs and PiezoMUMPs are suitable for researchers working in the area of bulk micromachining. In SOIMUMPs, the devices are realized by etching the device layer of a Silicon-On-Insulator (SOI) wafer. The devices are later released by selective etching of thick handle layer of the SOI wafer from the back while protecting the front side of the wafer. The PiezoMUMPs is an extended process of SOIMUMPs where a thin layer of a piezoelectric material is deposited and patterned to obtain devices that use piezoelectricity for transduction. The webinar will touch upon all these three MUMPs platforms with their design rules and critical realizable dimensions. It will end with application examples of devices that are realized using these processes.