Electrical-Thermal Co-simulation of 3D-IC Structures Using Celsius Thermal Solver скачать в хорошем качестве

Electrical-Thermal Co-simulation of 3D-IC Structures Using Celsius Thermal Solver

This pre-recorded webinar explains the forces driving electronics designers to utilize advanced 3D packaging methods and shows an analysis of a System on Integrated Chips (SoIC) design. Temperature profiles are plotted for thermal, electrothermal, and transient behaviors using the Celsius™ Thermal Solver. Find more great content from Cadence: Subscribe to our YouTube channel:    / @cadencedesignsystems   Connect with Cadence: Website: http://www.cadence.com Facebook:   / cadencedesign   LinkedIn:   / cadence-design-systems   Twitter:   / cadence   About Cadence Cadence enables electronic systems and semiconductor companies to create the innovative end products that are transforming the way people live, work and play. Cadence® software, hardware and semiconductor IP are used by customers to deliver products to market faster. The company’s Intelligent System Design strategy helps customers develop differentiated products—from chips to boards to intelligent systems—in mobile, consumer, cloud data center, automotive, aerospace, IoT, industrial and other market segments. Cadence is listed as one of Fortune Magazine's 100 Best Companies to Work For. Learn more at www.cadence.com.