Testing Piezoelectric MEMS Micro Speakers - Michael Ricci (Xmems) скачать в хорошем качестве

Testing Piezoelectric MEMS Micro Speakers - Michael Ricci (Xmems)

Synopsis: Ongoing advancements in MEMS fabrication processes has resulted in a new micro speaker using piezoelectric materials to actuate an acoustic structure. The radiating surface or membrane has several desirable attributes including, stiffness/rigidity, light weight, high break-up, fast transient response, low thermal expansion and moisture/humidity resistance. Packaged in a familiar semiconductor housing, these piezoelectric MEMS micro speakers are SMT reflowable on flex/PCB or can be soldered with leads. Full Hi Resolution/HD audio with 20 Hz to 20 kHz bandwidth in achieved in an occluded earbud design. This presentation will detail the challenges of making audio measurements with piezoelectric MEMS micro-speakers using a B&K Type 3670 8×2 Audio Interface with a Type 4157 IEC711 coupler and Type 4620 high frequency ear simulators. Test equipment selection, audio lab requirements, raw transducer testing as well as systems-level testing will be detailed. Also, acoustic tuning guidelines for integrating piezo-MEMS micro-speakers into wired and TWS earbuds will also be shared. To deliver quality sound, it is essential to analyze the sound produced by your device during the development phase as well as ensuring the audio quality is maintained during manufacturing. A multitude of parameters are critical to authentic sound reproduction. Check our Electroacoustics dedicated page and learn how HBK can be the perfect partner to help you overcome your audio challenges: https://www.bksv.com/en/knowledge/app...