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Today's show is covering the two recent foundry events: TSMC and Intel. Lots of next-generation technologies discussed. Timestamps: [00:00:00] - Pre-Show [00:06:12] - Show Starts [00:08:06] - TSMC Tech symposium [00:09:50] - AI is going to be everywhere [00:12:48] - TSMC Revenue breakdown [00:15:00] - Nodes [00:16:45] - TSMC A14 [00:18:21] - TSMC A16 [00:19:32] - TSMC N2 [00:23:53] - TSMC N3 [00:25:34] - Advanced Packaging [00:26:14] - Q Cybot_2419 : Where is N3B on the chart? [00:26:40] - Back to Advanced Packaging [00:30:29] - Chip on chip packaging [00:31:55] - Power Delivery [00:36:45] - Tech symposium wrap-up [00:39:28] - Q : Ahmad Ali - Wouldn't they have to ship it back to Taiwan from Arizona for packaging? [00:41:49] - Q : Gregan Dark - Forksheet transistors will be skipped? [00:43:40] - Intel Foundry news [00:49:55] - Intel 18A and 18A-P updates [00:54:16] - Technology node roadmap [00:58:30] - Q : Ahmad Ali - What's the minimum amount of usable chips from a single wafer? [00:58:40] - 14A and 14A-E news [01:00:10] - Advanced Packaging [01:00:40] - George Arrives! [01:00:50] - Back to Advanced Packaging [01:04:25] - Updates to EMIB naming [01:05:23] - Updates to the Foveros naming [01:08:10] - Foveros Direct3D updates [01:09:47] - Co-packaged optics [01:11:48] - A 14A wafer is shown [01:12:26] - "Intel's vision of the future" [01:23:30] - Q : Cybot_2419 - Watercooling channels between compute die and SRAM? [01:24:00] - Government works [01:27:53] - Back to Advanced Packaging [01:29:53] - more 18A talk [01:30:30] - High NA/Low NA 14A [01:32:08] - What chip is that? [01:35:30] - EMIB-T closeup [01:37:05] - EMIB scalability [01:39:04] - Power delivery [01:40:20] - Die sort, Die Prep [01:44:49] - Demo area, non-x86 solutions [01:49:12] - Fab questions [02:00:00] - Graviton 4 [02:01:42] - George is mad about Nvidia shenanigans [02:13:05] - Wrap up and goodbyes