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This example serves as an introductory guide to fluid flow simulations and conjugate heat transfer. The geometric file can be found in the link below: https://drive.google.com/file/d/1S43I... The system being modeled includes an aluminum heat sink designed to cool electronic circuit components mounted inside a rectangular channel. This setup is used to evaluate the cooling performance of heat sinks. Air enters the channel at the inlet and exits at the outlet. A 1 W heat flux is applied to the base surface of the heat sink from an external heat source, while all other external surfaces are thermally insulated. The heat sink's cooling capacity is assessed by tracking the temperature of its base surface. The model solves for the thermal balance between the heat sink and the airflow in the rectangular channel. Heat is transferred via conduction within the aluminum heat sink, and both conduction and convection occur within the cooling air. The temperature field remains continuous across the internal surfaces where the heat sink interfaces with the air inside the channel. #fluidengineering #heattransfer #cae #fluidflow #mechanicalengineering #electronics #tutorial #comsol