Versatile Si-SiN Photonics Platform | CEA-Leti скачать в хорошем качестве

Versatile Si-SiN Photonics Platform | CEA-Leti

Versatile Si-SiN Photonics Platform CEA-Leti’s versatile Si-SiN photonics platform allows miniaturization, power efficiency, cost reduction and scalability of photonic integrated circuits (PIC). Pioneering silicon photonics for more than 15 years, CEA-Leti has designed a technology toolbox featuring state-of-the-art performance for communication, computing and optical sensing. CEA-Leti’s versatile Si-SiN photonics platform offers a broad range of processes on 200 mm and 300 mm wafers that leverage world-class pre-industrialization equipment. CEA-Leti’s fabrication platform enables large-scale integration of active and passive devices in a flexible CMOS compatible process. Beyond silicon, this versatile photonics platform also offers the integration of amorphous Si, SiGe, Ge and SiN layers, and III-V-bonded epi layers on the same wafer, providing the advantages of each material. This convergence of various photonic platforms combined into CEA-Leti’s platform helps addressing numerous applications from visible to mid-infrared with the same technology. Applications : Communication : Telecom, Datacom, 5G infrastructures, quantum cryptography for cybersecurity Computing : Computer communication for High Performance Computing (HPC), quantum computing and neuromorphic computing for AI Sensing : optical gas sensing, structural health monitoring and 3D sensing such as LIDAR Key Features : 300 mm SOI substrate with 310 nm Si, other thicknesses available Multilevel silicon patterning for silicon heights of 0, 65, 165 and 310 nm Selective Ge epitaxy SiN layer (optional) TiTiN heater 6 implant levels for p-type and n-type for electro-optic modulators and silicon doped heaters Silicide tungsten contact III-V collective die bonding Key achievements: Mature device library for O-band and C-band in a Process Design Kit (PDK), compatible with conventional CAD tools. III-V integration on CMOS-compatible process through collective die bonding Multilayer Si/Si or SiN/Si for 3D photonics 2D beam steering based on SiN OPA Tunable DBR, DFB, racetrack lasers Thank you for watching! Whether you are a company looking for a technological advantage for your product or a student, recent graduate, or technology professional looking for your next exciting career opportunity, check out the links below! ------ 🔔 Before you go, subscribe to our channel:    / @cea   ⏩ Follow us on LinkedIn: Leti - / leti ⏩ Follow us on X: @CEA_Leti - https://twitter.com/cea_leti?lang=fr ⏩ CEA-Leti breakthroughs and more on our website: http://www.leti-cea.com/cea-tech/leti... ⏩ Relive Leti Innovation Days: http://www.leti-innovation-days.com/ 🔍 Learn more about CEA-Leti in this short video: http://bit.ly/CEALeti