ROCm Open Software for AI: Advanced Insights S2E7 скачать в хорошем качестве

ROCm Open Software for AI: Advanced Insights S2E7

In this episode of Advanced Insights, AMD CTO Mark Papermaster sits down with Anush Elangovan, CVP of AI Software at AMD, to discuss how the company is building an open, developer-first AI software ecosystem. They unpack the journey behind ROCm 7, performance breakthroughs, expanded model support, and why open source innovation is critical for energy-efficient, scalable AI infrastructure. From hyperscaler deployments to enabling inference across cloud and edge, learn how AMD is shaping a more open and accessible AI future. 00:00 Advanced Insights Overview 00:45 Introduction & Welcome, Anush 01:06 Early Open Source Work with Chrome 03:23 AMD’s Hardware Stack: ROCm 04:24 Making ROCm Accessible and Seamless to Deploy 06:23 The ROCm Journey 08:04 An Agentic Approach to Documentation 09:15 Accelerating Software Development with AI 11:32 Expanding the AMD Developer Cloud and CI/CD Pipeline 13:25 Positive Response to AMD Developer Cloud 14:23 Optimizing Solutions at the Rack Level 16:44 Continuous Pursuit of Excellence 18:44 AMD’s Commitment to Open in Ecosystem Support 20:05 ROCm + Ecosystem: Tools for Developers to Move Fast 22:02 AI From Data Center to Workstation 25:51 What’s Coming in the Next 2-3 Years? 27:59 Leveraging AI to Augment—Not Replace—Our Work 29:50 Thank You, Anush 30:13 Takeaways 30:45 Where to Watch and Closing *** Subscribe: https://bit.ly/Subscribe_to_AMD Join the AMD Red Team Discord Server:   / discord   Like us on Facebook: https://bit.ly/AMD_on_Facebook Follow us on Twitter: https://bit.ly/AMD_On_Twitter Follow us on Twitch:   / amd   Follow us on LinkedIn: https://bit.ly/AMD_on_Linkedin Follow us on Instagram: https://bit.ly/AMD_on_Instagram ©2025 Advanced Micro Devices, Inc. AMD, the AMD Arrow Logo, and combinations thereof are trademarks of Advanced Micro Devices, Inc. in the United States and other jurisdictions. Other names are for informational purposes only and may be trademarks of their respective owners.