Back grinding wheel for silicon wafer скачать в хорошем качестве

Back grinding wheel for silicon wafer

Website:https://morediamondwheel.com/products... Email: info@moresuperhard.com 🔸Diameter (mm): D175, D195, D209, D305, D335, etc 🔸Bonded: Vitrified bond, Resin bond 🔸Application: back thinning, grinding and fine grinding of apphire epitaxial wafer, silicon wafer, gallium arsenide and GaN wafer. 🔸Manufacturing Processes for Silicon Wafers：Ingot, cropping, Peripheral grinding, Ingot slicing, double disc grinding or lapping, edge grinding, surface grinding, polishing, back grinding, dicing, chips...... 🔸Applicable Grinding Machine：The back grinding wheels can be used for the Japanese ,German, American, Korean and other grinders . Such as Okamoto , Disco, Strasbaugh and others grinding machine. #backgrindingwheelforsiliconwafer #backgrindingwheel #grindingwheel #diamondwheel #siliconwaferbackgrinding #SiliconWafers #backthinning #grindingandfinegrindingofapphireepitaxialwafer #siliconwafer #galliumarsenideandGaNwafer #Vitrifiedbonddiamondwheel #resinwheel #tool #diamondtool