Using Both Sides of the Wafer: TSMC and Intel’s 2nm Breakthrough with BSPDN Technology скачать в хорошем качестве

Using Both Sides of the Wafer: TSMC and Intel’s 2nm Breakthrough with BSPDN Technology

Discover BSPDN (Backside Power Delivery Network), the innovative technology introduced by TSMC and Intel in their 2nm process. This groundbreaking approach maximizes power delivery efficiency by utilizing both the front and back sides of the wafer. By separating power lines and signal lines, BSPDN minimizes circuit interference and enhances chip performance and power efficiency. This technology plays a pivotal role in advancing high-performance computing and AI semiconductors. However, it also comes with challenges, such as increased complexity and costs during implementation. In this video, we delve into the operating principles, advantages, and limitations of BSPDN, analyzing its impact on the semiconductor industry. Additionally, explore the contrasting design and manufacturing philosophies of TSMC, with its conservative approach, and Intel, striving to reclaim its lead. #TSMC #BSPDN #Efficiency Written by Error Edited by Jin-I Lee AI dubbing ▶ Perso : https://perso.ai #ESTsoft #Perso unrealtech2021@gmail.com