Thermal Analysis of Thin Film Materials: Thermal Conductivity and Coefficient of Thermal Expansion скачать в хорошем качестве

Thermal Analysis of Thin Film Materials: Thermal Conductivity and Coefficient of Thermal Expansion

Thin films are at the heart of modern electronics, batteries, displays, and barrier coatings, where small changes in thermal behavior can make or break real world performance. Understanding how these layers conduct heat and expand with temperature is essential for reliable design. In this webinar, we will walk through practical approaches for thermal analysis of thin films, combining thermal conductivity testing with C-Therm’s Trident Flex TPS thin film utility and thermal expansion measurements using Rigaku TMA. You will see how to generate high quality data on thermal conductivity, thermal diffusivity, and thermal effusivity in thin layers, and how to link this with thermal expansion and dimensional stability across temperature. Using real material and application examples, we will explore how to: Characterize thin film thermal conductivity and effusivity for coatings, adhesives, and encapsulants Measure thermal expansion with Rigaku TMA to understand stress, warpage, and dimensional stability Correlate thermal conductivity and thermal expansion data to improve stack design and reliability Use Flex TPS and TMA results to screen new materials faster and de risk scale up Whether you work on electronic packaging, flexible devices, barrier films, or functional coatings, this webinar will show how combining Trident Flex TPS and Rigaku TMA can give your team the thin film thermal data needed to design more robust products and justify material choices to stakeholders. Keywords: thin film thermal analysis, thin film thermal conductivity, thermal expansion of thin films, thermal effusivity, C-Therm Trident Flex TPS, Rigaku TMA, electronic packaging films, battery separator films, barrier coatings, flexible electronics