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Thermal Conductivity of Thin Film Materials

Simplifying thermal conductivity measurements is essential for characterizing thin film materials across a wide range of industrial applications. These materials are generally categorized based on their performance metrics: high thermal conductivity applications, primarily Thermal Interface Materials (TIMs), are used to efficiently dissipate heat from sensitive electronic components, while low thermal conductivity materials are utilized in thermoelectrics, thermal barrier coatings, and specialized packaging where insulation and protection are required. Depending on the specific technology, targeting lower conductivity can be the ideal performance goal for certain system use cases. The Trident system with its Flex TPS thin films utility is the best available method to get accurate thermal conductivity data for thin films materials. This approach employs a thin, flexible, double-sided sensor designed specifically for the thin films utility to analyze various sample formats. For instance, this method allows for the comparison of materials such as neat Gas Diffusion Layers (GDL) and MPL plus PTFE samples to evaluate their effectiveness in different environments. A key finding in this analysis is the significant impact of material densification; as a material is further densified, it creates better transfer networks, which leads to a direct and measurable increase in thermal conductivity. Keywords Thin Film Thermal Conductivity, Thermal Interface Materials (TIMs), Trident Thermal Analysis System, FLEX TPS, Thermal Barrier Coatings, Heat Dissipation in Electronics, Material Densification, Thermal Insulation Materials, C-Therm Trident, Thermal Analysis of Thin Films.