xPD capabilities for advanced semiconductor packages & 2.5 heterogeneous assemblies скачать в хорошем качестве

xPD capabilities for advanced semiconductor packages & 2.5 heterogeneous assemblies

Watch the Xpedition Package Designer overview video to learn why it's the design tool to beat! You will learn about xPD design solutions for physical design and verification of advanced semiconductor packages and 2.5 heterogeneous assemblies. Learn More: https://eda.sw.siemens.com/en-US/ic-p... ▶️ Connect with us: » LinkedIn:   / pcb-systems-design   » Blog: https://blogs.sw.siemens.com/semicond... » IC Packaging Community Discussion Board: https://community.sw.siemens.com/s/to... » Twitter:   / siemenssoftware   #Semiconductor #ElectricalEngineering #Engineering #ICdesign #SemiconductorElectronics 0:00 Introduction 0:01 IC Packaging Package Designer capabilities 0:25 FOWLP mounted on BGA package 0:53 Embedded dual-sided interposer bridge 1:21 Patented sketch routing on a FOWLP 1:37 Intelligent via arrays crankshafts 2:16 Dynamic routing in 2D & 3D 2:27 Dynamic timing delay tuning 3:23 Built-in geometry based DRCS 3:58 Built-in IBIS package model creation 4:14 Dynamic integration with Calibre for signoff