Die bond, Die bonging, Die Bonder / Flip Chip Bonder- High Precision Attach System(2020) скачать в хорошем качестве

Die bond, Die bonging, Die Bonder / Flip Chip Bonder- High Precision Attach System(2020)

Die bond, Die bonging, Die Bonder / Flip Chip Bonder- High Precision Attach System(2020) #Diebond #Diebonging #DieBonder #FlipChipBonder #HighPrecisionAttachSystem Product Description: The product is taken out from the magazine by a precise delivery track ，Wafer auto stripping and feeding and positioned precisely;The multi-axis high-precision manipulator is visually guided by the industrial camera to complete the precision dispensing and wafer loading process of the product. Equipment application and industry: Semiconductor production technique and CCM camera module dispensing and laminating technique, to meet the position accuracy requirements of upper and lower assembly and lamination. Features: 1. High efficiency, overall UPH≥5000 pcs/H 2. High yield，yield≥ 99% (In addition to product incoming factors) 3. High precision, XY position accuracy :±10 μm deflection Angle ±0.2°bond head pressure 100~1000g (programmable) More info and product video, please see our website: https://shuangshikeji.en.made-in-chin... http://www.shuangshikeji.com/ http://www.dwinauto.com/ 1000#Die bond, Die bonging, Die Bonder / Flip Chip Bonder- High Precision Attach System(2020) 2000#Die bond, Die bonging, Die Bonder / Flip Chip Bonder- High Precision Attach System(2020) 3000#Die bond, Die bonging, Die Bonder / Flip Chip Bonder- High Precision Attach System(2020) 4000#Die bond, Die bonging, Die Bonder / Flip Chip Bonder- High Precision Attach System(2020) 5000#Die bond, Die bonging, Die Bonder / Flip Chip Bonder- High Precision Attach System(2020) 6000#Die bond, Die bonging, Die Bonder / Flip Chip Bonder- High Precision Attach System(2020) 7000#Die bond, Die bonging, Die Bonder / Flip Chip Bonder- High Precision Attach System(2020)