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Automated assembly of edge-emitting laser diodes onto AIN sub-mounts using process gas to prevent or reduce oxidation during bonding. Including process results. Equipment: Finetech’s automated die bonder with placement accuracy of 2.0 µm @ 3 Sigma and ultra-low bonding down to 5 gram-force. The efficient solution for chip-on-submount assembly of photonic and optoelectronic applications. 0:00:00 Laser diode packaging specifications 0:00:14 Loading machine with materials: edge-emitting laser diodes, AlN submounts, process gas enclosure for heating plate 0:00:45 Start of automated Chip on Submount assembly process 0:01:32 Start of automated Chip on Submount assembly process with system camera view 0:02:00 Process results Product details: https://www.finetech.de/products/fine... Stay connected: / finetech #DieBonder #finetech #PhotonicsPackaging #ChipOnSubmount #LaserDiodePackaging #BondingLaserChips #EdgeEmittingLaserDiodes #DieBondingProcess About Finetech Finetech is a leading global supplier of micro assembly and professional SMD rework equipment for customers involved in the development and manufacturing of opto- and microelectronics. Finetech’s die bonder systems, with up to 0.3 micron placement accuracy, support a wide range of advanced bonding technologies to implement the most precise and complex applications. Finetech follows the “Prototype-to-Production” approach to support customers at the development stage and help them transition their processes into production. This makes Finetech equipment the perfect fit for flexible and cost-efficient product development and manufacturing. The company serves a broad range of industries, including Datacom & Telecom, Industrial Semiconductor, Consumer Electronics, Medical, Aerospace & Avionics, Automotive, Defense & Security, Energy, as well as universities and research facilities. With subsidiaries on three continents and a global network of representatives, Finetech ensures quick response times, fast on-site service and personal consultation https://www.finetech.de