Custom Tool Development Strategies for Chiplet Reliability | COIN-3D Second Webinar скачать в хорошем качестве

Custom Tool Development Strategies for Chiplet Reliability | COIN-3D Second Webinar

📺 Watch the COIN-3D Webinar #2 – Custom Tool Development Strategies for Chiplet Reliability 🗓️ Originally held on 28 March 2025 | 12:00–13:15 CET In this session, we explored custom tool development strategies for enhancing the reliability of 2.5D and 3D chiplet-based architectures. Our expert speakers shared research insights, methodologies, and tool development experiences targeting critical challenges in semiconductor reliability. 📌 Contents of this video 📌 00:00 - Introduction 01:51 - CoMeT: Interval Thermal Simulator for 3D ICs 14:14 - Physical Hierarchy Exploration of 3-D ICs 42:25 - PROTON: Physics-Based Electromigration Assessment on Modern VLSI Power Grids 58:44 - Q&A Session 🎙️ Speakers: 🔹 Dr. George Floros – University of Thessaly 🔹 Dr. Anuj Pathania – University of Amsterdam 🔹 Dr. Olympia Axelou – University of Thessaly 🔹 Dr. Alberto Garcia-Ortiz – University of Bremen 🌐 COIN3D is a collaboration between: University of Thessaly University of Amsterdam University of Bremen University of Glasgow 💡 The project is co-funded by the European Union under the Horizon Europe programme. 🔗 Learn more: https://coin3d-project.eu 🔔 Subscribe for more updates on AI, VLSI, and semiconductor reliability! #COIN3D_EU #HorizonEurope #3DVLSI #Semiconductors #EDA #ChipletReliability #CustomTools #Innovation #Research