INEMI Adhesives Characterization for Optical Packaging Project Webinar (May 14, 2025) скачать в хорошем качестве

INEMI Adhesives Characterization for Optical Packaging Project Webinar (May 14, 2025)

This webinar discusses plans for INEMI’s Adhesives Characterization for Optical Packaging (ACOP) Project, which is a collaborative effort between INEMI and MIT FUTUR-IC that aims to accelerate development and adoption of optical adhesive materials and testing methods to ensure the processability and performance required for future photonics and optoelectronics applications. The project’s objectives ad outcomes include: • Develop test devices and vehicles for material studies for industry use and standards development. • Evaluate and characterize representative materials and test methodologies, assembly process variables and package-level reliability. • Develop guidelines and best practices for materials characterization, and a common set of test methodologies to accelerate standards development for industry. • Publish results (material characterization, comparison of test methodologies, assembly process and reliability data). Download a copy of the webinar presentation: